Realme has already confirmed that it will be among the first brands to utilize the MediaTek Dimensity 8400 SoC in one of its smartphones. According to earlier rumours, this device is expected to be the Realme Neo7 SE.
Now, prominent leaker Digital Chat Station has revealed that the phone will feature the Dimensity 8400-Max SoC, distinguishing it from the Dimensity 8400-Ultra used in the Redmi Turbo 4, the first phone to launch with this chipset. The leaker also mentioned that the Neo7 SE will come with a 1.5K flat OLED display and shared an image from the phone’s MIIT certification, identified by the model number RMX5080.
The image reveals a dual-camera setup on the rear, reportedly featuring a 50MP Sony IMX882 sensor for the main camera and an 8MP ultra-wide sensor. Other key features include a plastic frame, an optical in-display fingerprint scanner, and a massive 7000mAh battery with 80W fast charging support.
The Realme Neo7 SE is expected to launch in February 2025, we should know more details in the coming days.
