Qualcomm has introduced the Snapdragon 7s Gen 3 Mobile Platform, a new 4nm mid-range SoC that builds on its predecessor, the Snapdragon 7s Gen 2. The chip features integrated on-device AI capabilities and supports LLMs like Baichuan-7B and Llama 2 (1B parameters).
This platform, which powers devices such as the latest realme 13 Pro series, offers nearly 20% better performance and 45% power savings compared to the previous generation. The updated Qualcomm Adreno GPU delivers up to 40% improved performance, while the Qualcomm AI Engine boasts over 30% enhanced AI performance.
The Snapdragon 7s Gen 3 also includes a 12-bit triple ISP with 4K sHDR and integrates the Snapdragon 5G Modem-RF System. It supports 5G Dual-SIM Dual-Active (DSDA), allowing the simultaneous use of two 5G or 5G+4G SIM cards. Additionally, the platform features the Qualcomm FastConnect Mobile Connectivity System, which supports Bluetooth 5.4 and triple-frequency location services.
Qualcomm Snapdragon 7s Gen 3 (SM7635) Specifications -
CPU | 1 x Kryo Prime CPUs (Cortex A720-based) at up to 2.5GHz, 3 x Kryo Performance CPUs (Cortex A720-based) at up to 2.4GHz, 4x Kryo Efficiency CPUs (Cortex A520-based) at up to 1.8GHz |
Process | TSMC 4nm process Process Technology |
RAM/Storage | LPDDR5 3200MHz memory, LPDDR4x 2133 MHz, up to 16 GB, USB-C 3.1 Gen 2, UFS 3.1 |
GPU | Qualcomm Adreno GPU, OpenGL ES 3.2, OpenCL 2.0 FP, Vulkan 1.3 |
Sensors | GPS, Glonass, BeiDou, Galileo, QZSS, NavIC capable, Triple Frequency GNSS (L1/L5/L2), Sensor-Assisted Positioning: Urban pedestrian navigation with sidewalk accuracy, Global freeway lane-level vehicle navigation |
Camera |
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Display | On-Device Display Support: FHD+ @ 144 Hz, Maximum External Display Support: Up to 4K @ 60 Hz, 10-bit colour depth, HDR10 and HDR10+ |
Qualcomm Artificial Intelligence (AI) Engine | Qualcomm Hexagon NPU: Fused AI Accelerator, Hexagon Tensor Accelerator, Hexagon Vector eXtensions, Hexagon Scalar Accelerator, Support for mix precision (INT4, INT8, and INT16), Qualcomm Sensing Hub, Dedicated NPUs for audio and sensors |
Video | Hardware-accelerated H.265 and VP9 decoder; HDR Playback Codec support for HLG, HDR10+, HDR10, and HDR vivid |
Audio | Qualcomm Aqstic audio codec (WCD9385), New Qualcomm Aqstic smart speaker amplifier (WSA8835), Total Harmonic Distortion + Noise (THD+N), Playback: -108dB, Qualcomm Audio and Voice Communication Suite |
Network | Built-in Qualcomm Snapdragon 5G modem-RF system, 5G mmWave and sub-6 GHz, 5G download speeds of up to 2.9Gpbs |
Multi-SIM | 4G/5G Dual-SIM Dual Active (DSDA), VoLTE with SRVCC to 3G and 2G, Voice over Wi-Fi (VoWiFi) with LTE call continuity, HD and Ultra HD Voice (EVS) |
Connectivity | Wi-Fi 6E, 802.11ax (Wi-Fi 6) Multi-gigabit, Integrated 802.11ax, 2.4 GHz, 5 GHz and 6GHz, Bluetooth 5.4, LE Audio, LE Audio, Snapdragon Sound Technology Suite, with support for Qualcomm aptX Voice, aptX Lossless, aptX Adaptive, and LE audio, NFC |
Charger | Qualcomm Quick Charge 4+ technology |
Availability -
The Snapdragon 7s Gen 3 will first be adopted by Xiaomi, with the debut device likely to be revealed in September. Rumours suggest this could be the Redmi Note 14 Pro series. Realme, Samsung, and Sharp have also confirmed plans to incorporate this chip into their devices in the upcoming months.
Regarding the launch, Chris Patrick, Senior Vice President and General Manager of Mobile Handsets at Qualcomm Technologies, Inc., stated:
"The Snapdragon 7s Gen 3 will bring the standout features of the 7-series to more mid-tier devices by incorporating key elements like on-device AI support. This platform further demonstrates our commitment to providing best-in-class mobile experiences to consumers across all price ranges."