MediaTek has launched its latest processor in the 6000 series the Dimensity 6100+ SoC after the launch of Dimensity 6020 and 6080 SoCs. It has an upgraded 5G modem that supports the 3GPP Release 16 standard. It offers advanced features such as up to 140MHz 2CC 5G Carrier Aggregation, enabling faster and more efficient data transmission. Additionally, the device is equipped with MediaTek UltraSave 3.0+ technology, which optimizes power consumption for improved battery efficiency.
The chip boasts a configuration consisting of two powerful Arm Cortex-A76 cores for high-performance tasks, along with six Arm Cortex-A55 efficiency cores for optimized power usage. It provides support for AI-driven camera capabilities, 10-bit displays, exceptional user experience, enhanced GPU performance, and a wide range of peripheral features.
The Dimensity 9000 series is specifically crafted for flagship smartphones and tablets, offering top-tier performance. The Dimensity 8000 family targets premium mobile devices, delivering a blend of power and sophistication. With the Dimensity 7000 lineup, the company expands its range of advanced devices, while the new Dimensity 6000 series aims to bring high-end features to mainstream 5G devices, making them more accessible to a wider audience, as per MediaTek.
MediaTek Dimensity 6100+ Features -
| Process | TSMC N6 (6nm-class) |
| CPU | 2x Cortex-A76 @ 2.2GHz 6x Cortex-A55 @ 2GHz |
| Graphics | Mali-G57 MC2 |
| Memory | LPDDR4x 2133MHz, UFS 2.2 (2-lane) |
| Display | 2520 x 1080 (Full HD+) at 21:9 120Hz |
| Video Decode / Video Encode | 2160p (2160 x 1080), h.264, h.265 / HEVC 4K 30fps |
| Camera | 16MP+16MP, 108MP,Hardware MFNR, 3DNR, AI-FD |
| Modem | 2G / 3G / 4G / 5G Multi-Mode, 4G Carrier Aggregation (CA), 5G Carrier Aggregation (CA), EDGE, 4G FDD / TDD, 5G FDD / TDD, GSM, TD-SCDMA, WCDMA |
| Connectivity | Integrated Dual-Band Wi-Fi 5 (a/b/g/n/ac), Bluetooth 5.2, GPS L1CA+L5 BeiDou B1I+ B2a Glonass L1OF Galileo E1 + E5a QZSS L1CA+ L5 NavIC |
Availability -
The first smartphones powered by Dimensity 6100+ SoC will be available in the third quarter of 2023, according to the company.
