Qualcomm has unveiled the latest addition to the company's mid-range 7 series Mobile Platform the Snapdragon 7 Gen 3, succeeding the Snapdragon 7 Gen 1. It maintains the 1+3+4 architecture, akin to the Snapdragon 7+ Gen 2 introduced earlier this year. Featuring Kryo CPUs, the chip comprises 1 x 2.63 GHz ARM Cortex-A715 prime core, 3 x A715 performance cores clocked at up to 2.4 GHz, and 4 x Cortex-A510 efficiency cores reaching speeds of up to 1.8 GHz.
The newly introduced chip boasts nearly a 15% improvement in CPU performance compared to its predecessor, Snapdragon 7 Gen 1. Notably, the 7+ Gen 2 employed a 1 x 2.91GHz Cortex X2-based Prime core, which has now been replaced by the Cortex-A715.
Qualcomm asserts that the SoC delivers over 50% faster GPU performance compared to Snapdragon 7 Gen 1. While the Snapdragon 7+ Gen 2 featured a GPU with twice the performance of Snapdragon 7 Gen 1, the new chip utilizes the Adreno 720 GPU, a step down from the Adreno 725 in the 7+ Gen 2. The Qualcomm AI Engine is highlighted for offering 60% better AI performance per watt compared to the Snapdragon 7 Gen 1. The SoC integrates a 12-bit Triple ISP with support for up to 200MP photo capture.
In terms of connectivity, the SoC incorporates the Snapdragon X63 5G Modem-RF System. The 5G Dual-SIM Dual-Active (DSDA) feature enables simultaneous use of two 5G+5G or 5G+4G SIM cards, providing users with ultimate flexibility. The Qualcomm FastConnect 6700 Mobile Connectivity System supports Bluetooth 5.3, and the inclusion of new triple-frequency location support in the Snapdragon 7-series enhances location accuracy for a superior user experience, even in devices with lower-quality GNSS antennas, according to the company.
Qualcomm Snapdragon 7 Gen 3 (SM7550) Specifications -
| CPU | 1 x Kryo Prime CPUs (Cortex A715-based) at up to 2.63GHz, 3 x Kryo Performance CPUs (Cortex A715-based) at up to 2.4GHz, 4x Kryo Efficiency CPUs (Cortex A510-based) at up to 1.8GHz |
| Process | TSMC 4nm process Process Technology |
| RAM/Storage | LPDDR5 3200MHz memory, LPDDR4x 2133 MHz, USB-C 3.1 Gen 2, UFS 3.1 |
| GPU | Qualcomm Adreno GPU, OpenGL ES 3.2, OpenCL 2.0 FP, Vulkan 1.3 |
| Sensors | GPS, Glonass, BeiDou, Galileo, QZSS, NavIC capable, Triple Frequency GNSS (L1/L5/L2), Sensor-Assisted Positioning: Urban pedestrian navigation with sidewalk accuracy, Global freeway lane-level vehicle navigation |
| Camera |
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| Display | 4K @ 60 Hz, WFHD+ @ 168 Hz, WQHD+ @ 120 Hz, Maximum External Display Support: up to 4K @ 60 Hz, 10-bit color depth, Rec. 2020 color gamut, HDR10 and HDR10+, Adaptive HDR10, Ultra HDR |
| Qualcomm Artificial Intelligence (AI) Engine | Qualcomm Hexagon NPU: Fused AI Accelerator, Hexagon Tensor Accelerator, Hexagon Vector eXtensions, Hexagon Scalar Accelerator, Support for mix precision (INT4, INT8, and INT16), Qualcomm Sensing Hub |
| Video | Hardware-accelerated H.265 and VP9 decoder; HDR Playback Codec support for HDR10+, HDR10, HLG and Dolby Vision |
| Audio | Qualcomm Aqstic audio codec, New Qualcomm Aqstic smart speaker amplifier, Total Harmonic Distortion + Noise (THD+N), Playback: -108dB, Qualcomm Audio and Voice Communication Suite |
| Network | Built-in Qualcomm Snapdragon X63 5G modem-RF system, 5G mmWave and sub-6 GHz, 5G download speeds of up to 5Gpbs |
| Connectivity | Wi-Fi 6E, 802.11ax (Wi-Fi 6) Multi-gigabit, Integrated 802.11ax, 2.4 GHz, 5 GHz and 6GHz, Bluetooth 5.3, LE Audio, Dual Bluetooth antennas, Bluetooth audio: Snapdragon Sound Technology with support for Qualcomm aptX Voice, aptX Lossless, aptX Adaptive, and LE audio, NFC |
| Charger | Qualcomm Quick Charge 5 technology |
Availability -
Qualcomm has officially announced that prominent OEMs, including HONOR and vivo, are set to embrace the Snapdragon 7 Gen 3 platform, and the inaugural device is anticipated to be unveiled later this month. Richard Yu, the CEO of HUAWEI, has confirmed that the company will launch the HONOR X100 featuring the Snapdragon 7 Gen 3 chip on November 23rd.
