MediaTek has announced an event scheduled for December 23rd in China to unveil its next-generation Dimensity chipset. While the official invite does not disclose specific details, rumors suggest the launch of the Dimensity 8400 SoC as the successor to the Dimensity 8300.
The new Octa-Core processor is expected to retain the TSMC 4nm process of its predecessor but adopt an updated architecture featuring all Cortex-A725 cores, replacing the previous A5xx cores.
The rumored configuration includes -
- 1 x 3.25GHz Cortex-A725 core
- 3 x 3.0GHz Cortex-A725 cores
- 4 x 2.1GHz Cortex-A725 cores
- 1.3GHz Immortalis G720 MC7 GPU
Early benchmarks suggest the Dimensity 8400 achieves an impressive score of 1.8 million on AnTuTu, significantly outperforming the Dimensity 8300-Ultra-powered Redmi K70E (1.52 million points) and POCO X6 Pro (1.48 million points).
The Dimensity 8400 is anticipated to power devices such as the Redmi Turbo 4, expected to launch early next year. This chipset will replace the Snapdragon 8s Gen 3 featured in the Redmi Turbo 3.
More details, including the first device to feature the Dimensity 8400, will be revealed at the official launch next week.
