MediaTek has officially announced the launch of the Dimensity 8300, the successor to last year's Dimensity 8200, scheduled for November 21st in China. Details about the phone's specifications have emerged through the Geekbench 6 benchmark, which was conducted on the upcoming Redmi K70 with the model number Xiaomi 2311DRK48C.
The MediaTek Dimensity 8300 is reported to feature a configuration of 1 × 3.35GHz Cortex-A715 performance core, 3 × 3.32GHz Cortex-A715 performance cores, and 4 × 2.2GHz Cortex-A510 power-efficient cores, coupled with a Mali-G615 MC6 GPU.
In the benchmark results, the Dimensity 8300 exhibited a single-core score of 1512 and a multi-core score of 4886, showcasing a slight improvement over the Dimensity 8200 and the 8200-Ultra. According to leaks from Digital Chat Station, the performance of the Dimensity 8300 is anticipated to surpass that of the Qualcomm Snapdragon 7+ Gen 2 SoC. The chip will be manufactured using TSMC's N4 process.
As per the Geekbench leak, the Redmi K70 is expected to boast up to 16GB of RAM and will run on Android 14. Additionally, there will be another variant of the Redmi K70 powered by the Snapdragon 8 Gen 3, as confirmed by the company.
