MediaTek has launched its latest flagship processors the Dimensity 8100 and Dimensity 8000 with TSMC N5 (5nm-class) production process for premium 5G smartphones. This brings Dimensity 9000’s groundbreaking technology world-firsts including Imagiq 780 photo and video capture engine, new 5th generation AI processor with HyperEngine 5.0 gaming enhancements, and Release-16 5G modem.
The Dimensity 8100 has 4 Arm Cortex-A78 cores up to 2.85GHz, and the Dimensity 8000 has 4 Cortex-A78 cores up to 2.75GHz. These come with a Mali-G610 MC6 GPU with MediaTek’s HyperEngine 5.0 gaming technologies, frame rates for the Dimensity 8100 is up to 170fps and the Dimensity 8000 is 140fps.
Device makers can embrace the latest WHQD+ displays with up to 120Hz refresh rates by the new MiraVision 780 chip to ensure their smartphones offer flagship-grade resolutions with a 25% speed upgrade by previous generation Dimensity. It also supports New CUVA HDR-vivid certified Android smartphone platform, New HDR10+ Adaptive support, and 4K AV1 media decoding.
The Dimensity 8100 SoC comes with up to 20% more GPU frequency over the Dimensity 8000, and over 25% better CPU power-efficiency over our previous generation Dimensity chips, as per the company. Both these features Quad-channel LPDDR5 memory with UFS 3.1 storage ensure ultra-fast data streams.
MediaTek Dimensity 8100 and Dimensity 8000 Specifications -
| Dimensity 8100 | Dimensity 8000 | |
| Process | 5nm TSMC | 5nm TSMC |
| CPU | 4x Cortex-A78 @ 2.85GHz, 4x Cortex-A55 @ 2GHz | 4x Cortex-A78 @ 2.75GHz, 4x Cortex-A55 @ 2GHz |
| Memory | quad-channel LPDDR5 6400Mbps, dual-channel UFS 3.1 | quad-channel LPDDR5 6400Mbps, dual-channel UFS 3.1 |
| Camera | 200MP, Simultaneous dual camera HDR video recording, 5Gbps 14-bit HDR-ISPs / Video HDR / Video Bokeh / Video EIS / AI-Shutter / AI-AE / AI-AF / AI-AWB / AI-NR HDR / AI-HDR / AI-FD | 200MP, Simultaneous dual camera HDR video recording, 5Gbps 14-bit HDR-ISPs / Video HDR / Video Bokeh / Video EIS / AI-Shutter / AI-AE / AI-AF / AI-AWB / AI-NR HDR / AI-HDR / AI-FD |
| Graphics | Arm Mali-G610 MC6 | Arm Mali-G610 MC6 |
| Display | FHD+ @ 168Hz / WQHD+ @ 120Hz | FHD+ @ 168Hz / WQHD+ @ 120Hz |
| Video | H.264, HEVC, VP-9, AV1 / H.264, HEVC, 4K60 HDR10+ | H.264, HEVC, VP-9, AV1 / H.264, HEVC, 4K60 HDR10+ |
| Modem |
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| Connectivity | Integrated Wi-Fi 6E (a/b/g/n/ac/ax) 2T2R, Bluetooth 5.3, GPS L1CA+L5 / BeiDou B1I+ B2a + B1C / Glonass L1OF / Galileo E1 + E5a / QZSS L1CA+ L5 / NavIC | Integrated Wi-Fi 6E (a/b/g/n/ac/ax) 2T2R, Bluetooth 5.3, GPS L1CA+L5 / BeiDou B1I+ B2a + B1C / Glonass L1OF / Galileo E1 + E5a / QZSS L1CA+ L5 / NavIC |
Dimensity 1300 SoC -
MediaTek has also launched its latest mid-range processors the Dimensity 1300 6nm SoC, which is the successor of the popular Dimensity 1200 has HDR-ISP that supports up to 200MP and integrates MediaTek’s HyperEngine 5.0 that offers a comprehensive suite of gaming-related optimizations such as exclusive AI-VRS, Wi-Fi/Bluetooth Hybrid 2.0, plus wireless earbud latency improvements from Bluetooth LE Audio technology with Dual-Link True Wireless Stereo Audio. The Dimensity 1200 has HyperEngine 3.0 gaming technology.
According to the company, the AI benchmark scores from the six-core APU 3.0, promises up to 10% improvements for AI tasks. It also comes with new AI enhancements that improve night shot photography and HDR capabilities for great image clarity.
The Dimensity 8100, Dimensity 8000, and Dimensity 1300 processor-based phones will be introduced in the first quarter of 2022, as per MediaTek. Xiaomi has confirmed that the Redmi K50 series will be powered by Dimensity 8100, and the Realme GT Neo3 will also be based on the 8100 SoC. OnePlus also confirmed another phone powered by Dimensity 8100 chip. OPPO also share the post where it confirmed OPPO K10 will use Dimensity 8000 series chip.
