MediaTek has unveiled the Dimensity 6300 SoC as the latest addition to the Dimensity 6000 series, following last year's release of the Dimensity 6100+ SoC. This new chipset features an upgraded 5G modem that supports the 3GPP Release 16 standard, boasting up to 140MHz 2CC 5G Carrier Aggregation. Additionally, it incorporates MediaTek UltraSave 3.0+ technology for power efficiency, mirroring the capabilities of the 6100+.
The Dimensity 6300 is equipped with two Arm Cortex-A76 big cores running at 2.4GHz and six Arm Cortex-A55 efficiency cores clocked at 2GHz. It is touted to deliver CPU performance that is up to 10% faster than its predecessor, along with a GPU performance increase of over 50%.
MediaTek Dimensity 6300 Features -
| Process | TSMC N6 (6nm-class) |
| CPU | 2x Cortex-A76 @ 2.4GHz 6x Cortex-A55 @ 2GHz |
| Graphics | Arm Mali-G57 MC2 |
| Memory | LPDDR4x 2133MHz, UFS 2.2 (2-lane) |
| Display | 2520 x 1080 (Full HD+) at 21:9 120Hz |
| Video Decode / Video Encode | 2160p (2160 x 1080), h.264, h.265 / HEVC 4K 30fps |
| Camera | 16MP+16MP, 108MP,Hardware MFNR, 3DNR, AI-FD |
| Modem | 2G / 3G / 4G / 5G Multi-Mode, 4G Carrier Aggregation (CA), 5G Carrier Aggregation (CA), EDGE, 4G FDD / TDD, 5G FDD / TDD, GSM, TD-SCDMA, WCDMA |
| Connectivity | Integrated Dual-Band Wi-Fi 5 (a/b/g/n/ac), Bluetooth 5.2, GPS L1CA+L5 BeiDou B1I+ B2a Glonass L1OF Galileo E1 + E5a QZSS L1CA+ L5 NavIC |
Availability -
The initial release of smartphones featuring the Dimensity 6300 SoC is anticipated to commence with the launch of the realme C65 5G, slated for later this month in India, with subsequent launches in other markets to follow.
