MediaTek and TSMC have jointly announced the development of MediaTek's inaugural chip utilizing TSMC's cutting-edge 3nm technology, destined for MediaTek's flagship Dimensity system-on-chip (SoC).
While specific details about the chip remain undisclosed by MediaTek, the company has emphasized that TSMC's 3nm process technology delivers notable enhancements in terms of performance, power efficiency, and yield. This technology also provides comprehensive platform support for high-performance computing and mobile applications.
In comparison to TSMC's N5 process, TSMC's 3nm technology currently offers impressive advantages, including an up to 18% speed improvement at the same power consumption level or a 32% reduction in power consumption at the same speed. Additionally, it boasts an approximate 60% increase in logic density.
Senior Vice President of Europe and Asia Sales at TSMC, Dr. Cliff Hou said “This collaboration between MediaTek and TSMC on MediaTek’s Dimensity SoC means the power of the industry’s most advanced semiconductor process technology can be as accessible as the smartphone in your pocket.”
Availability -
MediaTek's inaugural flagship chipset, manufactured using TSMC's 3nm process, is anticipated to bring its capabilities to smartphones, tablets, smart vehicles, and a range of other devices, commencing in the latter part of 2024.
